WIREDRAWING METHOD OF METAL FINE WIRE FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiredrawing method of metal fine wire for a semiconductor device which improves longevity of a die while keeping surface smoothness of metal fine wire. SOLUTION: A desired diameter of metal fine wire 1' is produced by arranging plural number of dies 2a-2h and also capstans 3, 3' to draw a wire rod 1 which sequentially passes each die. In order to perform a wiredrawing by a single crystal diamond die after the wiredrawing is performed by a polycrystalline diamond die, a single crystal diamond die is arranged after the required number of the polycrystalline diamond dies. The wiredrawing process by the polycrystalline diamond dies is to be finished at the stage when a drawn mark on the surface of the wire rod 1 generated by wiredrawing is minute.