| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of inspecting and assembling a variable capacity diode device which increases the continuity of a chip characteristic and enables to improve the manufacturing yield of chips. SOLUTION: The order in which chips are taken out on a wafer is determined by a chip and sequence definition data process 14 which includes a reject chip process 22 and an insert chip process 23 as main processes. In the reject chip process 22, three stages of jobs including exclusion of chip data in a polarity inversion section, exclusion of chip data at the head of a data string, and exclusion of chip data at the end of the data string are conducted. In the insert chip process 23, three stages of jobs including insertion of refuge chip data into the original location, insertion of refuge chip data into two-point interpolated location, and insertion of refuge chip data into a location sufficing an error range.
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