| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a solid state imaging device being produced by packaging an image sensor, i.e., cost reduction and thinning are required to meet the expanding purposes but a packaging method for easily obtaining such thin-type solid-state imaging device at a low cost has not been developed. SOLUTION: At the time of packaging an image sensor chip comprising a large number of photoelectric conversion elements formed on one surface of a semiconductor substrate having a rectangular plan view, a lens body arranged on the large number of photoelectric conversion elements, and a pixel signal generating section operating with a drive signal being fed externally through a plurality of pads arranged on the semiconductor substrate, and generating a pixel signal based on the charge stored in each photoelectric conversion element, a low refractive index layer is formed on the lens body of a substance having a refractive index lower than that of the lens body, and a transparent plate having an end substantially overlapping the longitudinal end of the semiconductor substrate in plan view is placed on the low refractive index layer such that the lens body is covered while exposing each pad.
|
