| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a dummy pad of multilayer structure, which can be changed easily as a pad for probing. SOLUTION: The groups of the dummy patterns, 1a to 1c installed multiply independently of a multilayer structure, have multilayer wired region, where insulating layers and wiring layers are mutually arranged on a semiconductor element, idle regions where the wiring layers are not formed continuously for the prescribed number of layers from the prescribed layer to a surface layer in multilayer wiring on the semiconductor element and the continuous wiring layers to the surface layer in the idle regions. The dummy patterns 1a to 1c of the respective groups are connected by a through-hole 3. The lowest dummy pattern 1a in the dummy patterns of the prescribed group is connected to a part, where probing of the semiconductor device is required by wiring and the through-hole, and is used as the pad for probing.
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