| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system with which metallic film thickness is made uniform, and productivity is made satisfactory. SOLUTION: In a sputtering system in which gas ions are collided against a target consisting of metal, and metallic grains are scattered from the target to deposit the metallic grains on a body to be worked, the metallic grains are deposited while rotating the body to be worked.
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