FAILURE CORRECTING METHOD, TREATING DEVICE OF SUBSTRATE, FAILURE SPECIFYING DEVICE AND FAILURE CORRECTING SYSTEM

摘要

PROBLEM TO BE SOLVED: To properly correct a failure when the failure related to film thickness of a resist film is generated. SOLUTION: Two sheets of wafers which are completed in film forming treatment are conveyed respectively to a rotation unit 50 and a film thickness measuring unit 25 in order and the film thickness at the part of different diameter is measured. In accordance with the film thickness profile obtained by the measurement, a deviation of the swollen part of the resist film is grasped and the position of a main conveyance unit 40 or the exhaust in a pre-baking unit is controlled so as to dissolve the deviation on the basis of the deviation. As a result, the failure related to film thickness of the resist film is dissolved.