发明名称 STRUCTURE OF CASSETTE LEAD OF FUSION UV BAKE EQUIPMENT
摘要 PURPOSE: A structure of a cassette lead of fusion UV bake equipment is provided to prevent an over-abrasion phenomenon due to repeating wafer loading processes by using a ball screw method instead of an existing lead screw method. CONSTITUTION: A cassette platform assembly of fusion UV bake equipment includes a cassette switch panel and a lead screw assembly. The cassette switch panel includes a cassette switch actuator, a guiding screw, and a cassette switch. A ball screw assembly(30) includes a motor(31), a set screw(32), a ball screw(33), an assembly mounting screw(34), and an actuator(35). The actuator(35) has a ball bearing. A process error is not generated by over-abrasion since the actuator(35) is coupled with the ball screw(33) by using the ball bearing(36) through a wafer loading process is performed repeatedly.
申请公布号 KR20030006228(A) 申请公布日期 2003.01.23
申请号 KR20010041925 申请日期 2001.07.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, CHAN UI
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址