| 摘要 |
PURPOSE: A chassis is provided which suppresses generation of dew condensation and has complete sound proofing property and superior natural aesthetics by integrally bonding a board processed to a certain thickness to the surface of the chassis in a process. CONSTITUTION: The method for bonding a board(1) to the surface of chassis comprises a cutting process(10) of processing the bottom of the board having a thickness of about 10 mm in the same shape as the external shape of the chassis(7) by a cutter(3) mounted on a molder(5); a coating process(20) of coating an adhesive to a uniformed thickness on the upper surface of the chassis; a pseudo-adhesion process(30) of bonding a processed board onto the upper surface of the adhesive coated chassis; and a compression process(40) of entering the chassis onto the upper surface of which the board is pseudo-bonded into an adhesive machine(37) comprising hot rollers(33) heated to a temperature of 400 to 500 deg.C and subsidiary rollers(35) made of urethane so that the chassis and board are integrally bonded, wherein the external surface of the board is processed in a plane or curved surface, and thickness of the processed board is 3 to 5 mm.
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