| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic device with excellent air-tightness and excellent reliability of a hollow part that can be manufactured by a simple method. SOLUTION: In the surface acoustic wave device with a protection layer where a surface acoustic wave chip is mounted on a substrate formed with a wiring pattern, an electrode face on which a surface acoustic wave electrode of the surface acoustic wave chip is formed and a face formed with the wiring pattern of the substrate are placed opposite to each other, the surface acoustic wave electrode and the wiring pattern are connected by bump, the surface acoustic wave electrode face and the wiring pattern forming face are parted by the height of the bump, and the part between the surface acoustic wave electrode face and the wiring pattern forming face parted by the height of the bump is covered to keep a hollow structure by the protection layer made of a gel curing sheet formed from a face opposite to the electrode face of the surface acoustic wave chip over the substrate front side and the surface acoustic wave device is manufactured by the heat press method.
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