Method of processing and plating wafers and other planar articles

摘要

A wafer process methodology characterized by horizontal transport of vertically-oriented wafers into one or more process cells for performing vertical processing on the wafers. The process methodology also includes simultaneous processing of a plurality of vertically-oriented wafers at indexed positions along the horizontal transportation route. Additionally, the process methodology further includes loading of wafers onto carriers in a horizontal fashion and then rotating the carriers to orient the wafers vertically for transport and processing.