| 摘要 |
PROBLEM TO BE SOLVED: To provide a plate material for waterless lithography which enables writing by reduced energy and does not need sediment removing treatment after writing. SOLUTION: A heat melting film 12 is bonded to a substrate 11 having fine unevenness on the surface while gaps 11a are left, and a member (ink repellent layer) 13 having ink releasing properties is formed on the film 12. The film 12 is melted when heated from the outside, holes are opened, and the ink repellent layer 13 is removed. After that, the ink enters the hole by inking to form an image part. |
