发明名称 |
SPUTTERING APPARATUS HAVING SHIELDING PLATE FORMED WITH GAS INDUCTION TUBE |
摘要 |
PURPOSE: A sputtering apparatus having a shielding plate formed with a gas induction tube is provided to distribute and mix uniformly gases by using a shielding plate having a gas induction path. CONSTITUTION: A chamber(210) is connected with a vacuum pump(280). A plurality of gas supply portions(270a,270b) are connected with one side of the chamber(210). A target holder(230) is formed at an upper side of the inside of the chamber(210). A target(240) is adhered on a target holder(230). A voltage supply portion(250) is installed at the target holder(230). The voltage portion(250) applies a predetermined voltage to the target(240) in order to collision smoothly plasma(260) with the target(240). A cooling portion is used for cooling the heat generated from the collision between the plasma(260) and the target(240). A wafer holder(220) is adhered on a lower center of the inside of the chamber(210). A heater is installed at the wafer holder(220). A rotary portion rotates a wafer by using a motor. A gas induction path(297) and a plurality of holes(295) are formed on a wall face of a shielding plate(290).
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申请公布号 |
KR20030004686(A) |
申请公布日期 |
2003.01.15 |
申请号 |
KR20010040315 |
申请日期 |
2001.07.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YEONG SEON;LEE, JAE UK |
分类号 |
H01L21/203;(IPC1-7):H01L21/203 |
主分类号 |
H01L21/203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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