发明名称 SPUTTERING APPARATUS HAVING SHIELDING PLATE FORMED WITH GAS INDUCTION TUBE
摘要 PURPOSE: A sputtering apparatus having a shielding plate formed with a gas induction tube is provided to distribute and mix uniformly gases by using a shielding plate having a gas induction path. CONSTITUTION: A chamber(210) is connected with a vacuum pump(280). A plurality of gas supply portions(270a,270b) are connected with one side of the chamber(210). A target holder(230) is formed at an upper side of the inside of the chamber(210). A target(240) is adhered on a target holder(230). A voltage supply portion(250) is installed at the target holder(230). The voltage portion(250) applies a predetermined voltage to the target(240) in order to collision smoothly plasma(260) with the target(240). A cooling portion is used for cooling the heat generated from the collision between the plasma(260) and the target(240). A wafer holder(220) is adhered on a lower center of the inside of the chamber(210). A heater is installed at the wafer holder(220). A rotary portion rotates a wafer by using a motor. A gas induction path(297) and a plurality of holes(295) are formed on a wall face of a shielding plate(290).
申请公布号 KR20030004686(A) 申请公布日期 2003.01.15
申请号 KR20010040315 申请日期 2001.07.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YEONG SEON;LEE, JAE UK
分类号 H01L21/203;(IPC1-7):H01L21/203 主分类号 H01L21/203
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