| 摘要 |
A small image pickup module according to the present invention comprises a substrate, a semiconductor device chip for image pickup, a lens-barrel body, an infrared light blocking filter, a lens, and a diaphragm, in order to attempt to make assembly work easy and to reduce costs. The substrate is made from a nonmetal including a ceramic or the like. The semiconductor device chip for image pickup includes a two-dimensional C-MOS image sensor or the like which is mounted on the substrate. The lens-barrel body is adhered, as a reference to the substrate so as to cover the semiconductor device chip for image pickup, by using a potting material to be used for COB (Chip On Board) mounting as an adhesive. The infrared light blocking filter, lens, and diaphragm are respectively mounted on the lens-barrel body.
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