| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, at the time of wire bonding, a shimmer is generated from an inert gas used for preventing oxidation of a substrate due to a difference in temperature at the time of bonding, reducing a pattern recognition accuracy. SOLUTION: In a bonding equipment 21 provided with a recognition equipment, shielding covers 31, 32, and 33 are located below an up and down moving section of an illumination ring 25 and a body tube 29. A shimmer 37 of a nitrogen gas blown out from a working hole 24 can be prevented from entering the illumination ring 25, especially by means of the shielding cover 31 below the illumination ring 25. Consequently, a recognition accuracy of a recognition camera can be increased, and furthermore, the increase in a wire bonding accuracy in the order of μm can be realized. |
