| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for establishing heating and compressively bonding conditions in heat-sealing a plastic material in order to improve reliability of a heat-sealing technique. SOLUTION: A measurement under a specific condition is conducted to obtain an optimum value of each of a heating temperature, compressively bonding pressure and time of a heat-sealed material containing a volatile component thereby to control a delay of temperature increase of the melt-bonded surface due to volatilization of the volatile component included in the heated material and a melt-bonding damage of the heat-sealed surface due to bumping gas current. |
