| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition having high sensitivity and ensuring a small reduction in film thickness. SOLUTION: The positive type photosensitive resin composition comprises 100 pts.wt. polybenzoxazole precursor (A), 1-50 pts.wt. photosensitive diazoquinone compound (B) which is the ester compound of a phenol compound having a backbone of formula (2) (where R5 -R8 are each alkyl, alkoxy or cycloalkyl and may be the same or different) and 1,2-naphthoquinone-2-diazido-5- sulfonic acid or 1,2-naphthoquinone-2-diazido-4-sulfonic acid and 1-30 pts.wt. phenol compound (C) of formula (3). |
