发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module, that can adjust the position of a post electrode corresponding to the position of an electrode pad at a package side for allowing the both to be subjected to wire bonding smoothly. SOLUTION: In the thermoelectric module, a thermoelectric element 11, comprising a plurality of Peltier elements, is arranged between an insulating lower substrate 10 made of Al2 O3 or the like and an upper substrate 12, and a plurality of lower and upper electrodes (not shown) are formed on the opposite surfaces of the lower and upper substrate 10 and 12. Then, two thermoelectric elements are bonded to each lower electrode, and an adjacent thermoelectric element 11 on an adjacent lower electrode is connected by one upper electrode, thus connecting a plurality of thermoelectric elements 11 by the lower and upper electrodes in series. Asymmetric lead layers 16a and 16b are connected to the lower electrode of two thermoelectric elements which are arranged at the end section of the serial connection, and post electrodes 15a and 15b are bonded onto the end section of the lead layers 16a and 16b.
申请公布号 JP2002374008(A) 申请公布日期 2002.12.26
申请号 JP20020107074 申请日期 2002.04.09
申请人 YAMAHA CORP 发明人 ONOE KATSUHIKO;HOSHI TOSHIHARU
分类号 H01L23/38;H01L35/08;H01L35/10;H01L35/34;(IPC1-7):H01L35/10 主分类号 H01L23/38
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