发明名称 |
HEADSET WITH OVERMOLD |
摘要 |
A headset is disclosed having a headband configuration that distributes the compression forces on the user's head to provide firm placement without causing discomfort to the user. The headband is preferably integrally formed with a soft overmold molded along a portion of its interface with the user's head. The headband terminates in first and second ends. Either or both ends may terminate in a flared temple pad for further distribution of compression forces or may terminate in an earphone. A boom is pivotally connected to either a temple pad or an earphone and is optionally conformable for positioning towards the wearer's mouth. The boom terminates in a microphone.
|
申请公布号 |
US2002196960(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010885143 |
申请日期 |
2001.06.20 |
申请人 |
PHAM HOA;CARPENTER MICHAEL |
发明人 |
PHAM HOA;CARPENTER MICHAEL |
分类号 |
H04R1/10;(IPC1-7):H04R25/00 |
主分类号 |
H04R1/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|