| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve efficiency in processing a substrate, to reduce the amount of wear of means for holding the substrate, and to increase its life. SOLUTION: This device has a rotor 1 having holding means for holding a plurality of wafers W arranged at appropriate intervals and a motor 4 for turning the rotor 1. The holding means has an opening/closing holding bar 3 which is opened or closed when the wafer W is inserted from the side and presses the wafer W by a centrifugal force produced by the rotation of the rotor 1 and a plurality of holding bars 2a to 2d which holds the wafer W in cooperation with the opening/closing holding bar 3. At least one of the holding bar 2a or 2b of the holding bars 2a to 2d has a plurality of holding pieces 5 each of which is elastically deformed in response to the pressing force of the opening/closing holding bar 3 to hold each wafer W. This can surely make the wafer W follow the rotation of the rotor 1 and reduce a slip between the opening/closing holding bar 3 and the bolding bars 2a to 2d and the wafer W.</p> |
