| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination of a substrate due to solder scattering or an overflow of flux when mounting electronic components on substrate using solder. SOLUTION: Solder paste 2a is printed on one surface 1a of a substrate 1, and an electronic component 3 is mounted on the solder paste 2a. On a non- solder arranging region 9 where the solder paste 2a is not arranged of the surface 1a of the substrate 1A, a covering member 11 for covering the region 9 in a state that an outer peripheral portion 11b contacts with the surface 1a of the substrate 1. Thereafter, the component 3 is connected to the substrate 1 by melting the solder paste 2a. |
