发明名称 METHOD FOR MANUFACTURING STACKED FLASH MEMORY CELL
摘要 PURPOSE: A method for manufacturing a stacked flash memory cell is provided to prevent a shift of threshold voltage of memory cells by enhancing a charge retention capability of a floating gate. CONSTITUTION: A gate oxide layer is formed on an active region of a semiconductor substrate(200). A structure sequentially stacked a floating gate, a dielectric film of ONO structure and a control gate are sequentially formed on a desired portion of the gate oxide(210-230). An oxide layer made of SiON is formed on the gate oxide layer including the stacked structure by an oxidation processing using N2O gas or NO gas as a source gas(240). An LDD(Lightly Doped Drain) region is formed in the substrate(250). After forming an insulating spacer at both sidewalls of the stacked structure(260), source and drain regions are formed(270).
申请公布号 KR20020094222(A) 申请公布日期 2002.12.18
申请号 KR20010031073 申请日期 2001.06.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, BYEONG DONG;KIM, MAN SU;PARK, YEON SIK;RYU, GYU BOK;SHIN, CHUNG HWAN
分类号 H01L21/8247;(IPC1-7):H01L21/824 主分类号 H01L21/8247
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