| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which realizes miniaturization and aims at yield improvement in the yield and in cost reduction. SOLUTION: In the piezoelectric oscillator, consisting of a semiconductor component including an oscillation circuit and an airtightly sealed piezoelectric vibrator, the semiconductor component is mounted on the top of a piezoelectric vibrator case, in which the opening of the case mounted with a piezoelectric element plate faces a circuit board to be mounted, and a lid is attached at the opening to form a sealed structure so that a step is formed between a circuit board and the surface for mounting the piezoelectric oscillator. By this constitution, the external shape of the case of the piezoelectric oscillator can be miniaturized close to the installation area of the semiconductor component to be mounted. Further, the semiconductor component is incorporated only in with obtains satisfactory characteristic as a piezoelectric vibrator to configure a piezoelectric oscillator, and the piezoelectric oscillator which is a finished project is configured, without the influences of the parallelism of the piezoelectric oscillator to the substrate surface of the mounting circuit, by employing a structure in which a lid is attached, so as to form a step with respect to the substrate surface of the mounting circuit, thereby solving problems of improving the yield and cost reduction.
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