| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for thin film elastic wave elements by which a forming time of a hole of a diaphragm part is shortened so as to enhance the mass-productivity. SOLUTION: The forming of the hole of a silicon substrate to be a diaphragm part is not all made by the anisotropic etching, but a hole with a prescribed depth is formed in advance from a rear side of a (100) plane silicon substrate on which a nitride film or the like is formed through physical processing and the anisotropic etching is used to form a hole furthermore after that. The hole is formed by groove processing utilizing a dicer and etching by an ion beam. An electrode film, a piezoelectric thin film and an electrode film are formed on the nitride film to obtain the thin film elastic wave vibrator.
|
