POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a power semiconductor device which is improved so as to enable enhancement of reliability. SOLUTION: Metal plates 6 are fixed to both surfaces of an insulation member 2. A power semiconductor element 1 is provided on one surface of the member 2 via the metal plate 6. A heat sink plate 4 is connected to other surface of the member 2 via the plate 6 by a solder layer 5. A refrigerant passage 12 for passing a refrigerant for cooling is provided in the plate 4. A width of the passage 12 is wider than that of the passage 12 at other part near an end of the layer 5.