发明名称 METHOD FOR REMOVING TITANIUM-BASED CONTAMINATIVE LAYER DEPOSITED ON BASIC MATERIAL OF TITANIUM COLLIMATOR BY USING SACRIFICIAL LAYER
摘要 PURPOSE: A method for removing a titanium-based contaminative layer deposited on a basic material of a titanium collimator by using a sacrificial layer is provided to remove selectively titanium and titanium nitride without a damage of the basic material by coating a sacrificial layer on a collimator and etching selectively only the sacrificial layer. CONSTITUTION: Titanium and titanium nitride(1) are deposited on a collimator. A sacrificial layer(2) is used for performing an etching process. The sacrificial layer(2) is not separated easily from a basic material(3) of a collimator by an external physical variation and an external thermal variation since the sacrificial layer(2) has an excellent adhesive strength and a low thermal expansion coefficient. The collimator is coated without generating an outgassing phenomenon since the collimator is used under a state of high vacuum. The collimator has thickness enough for removing the titanium and the titanium nitride(1).
申请公布号 KR20020091336(A) 申请公布日期 2002.12.06
申请号 KR20010029887 申请日期 2001.05.30
申请人 KOMI CO., LTD. 发明人 CHUN, HUI GON
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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