发明名称 |
Suspended-wafer chuck |
摘要 |
A method for applying a flame for depositing a doped layer to a wafer and chuck particularly adapted for suspending the wafer over the flame. The chuck includes a frame having an opening defined by an inner wall for receiving a wafer and a ledge surrounding at least a portion of a lower end of the opening for retaining a wafer placed into an upper end of the opening, and a suspension assembly for suspending the frame over a dopant-depositing flame such that the ledge is disposed between the flame and peripheral portions of the wafer. The inner wall and the ledge may be formed from a material having substantially the same thermal conduction and expansion characteristics as the wafer. The suspension assembly may be rotatable with respect to a dopant-depositing flame. The frame may have a plurality of openings, each for receiving a wafer. The suspension assembly may include a suspension member, and a support post connecting the suspension member to the frame. The frame may also have an outer portion formed from a material having substantially different thermal conduction and expansion properties than the opening and ledge.
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申请公布号 |
US2002179223(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20010872123 |
申请日期 |
2001.05.31 |
申请人 |
BOEK HEATHER D.;CARSON MICHAEL P.;HUANG HAIBO;LABORDE PASCALE;RYSZYTIWSKYJ WILLIAM P.;YOUNG ROBERT L. |
发明人 |
BOEK HEATHER D.;CARSON MICHAEL P.;HUANG HAIBO;LABORDE PASCALE;RYSZYTIWSKYJ WILLIAM P.;YOUNG ROBERT L. |
分类号 |
B44D5/00;(IPC1-7):B44D5/00 |
主分类号 |
B44D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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