| 摘要 |
An ion implanter having means for scanning an ion beam on a wafer is provided, wherein the scanning means, on which the wafer is mounted, moves the wafer in a region where the ion beam is irradiated. A detecting means, which is fixedly mounted adjacent to the scanning means, detects the ion beam that is overly scanned out of the scanning means. The detecting means has an inclined surface so that a portion of the detecting means adjacent to the scanning means is positioned below a surface of the wafer that is disposed on the scanning means. Accordingly, the ion implanter may prevent the wafer in the scanning means from being polluted with sputtering particles generated from a surface of the scanning means.
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