| 摘要 |
The present invention relates to a device testing interface that assists in the testing of fine pitched electronic assemblies. Three embodiments are defined. In the first embodiment, a flex probe comprises a flex circuit with probe tips. The probe tips are attached to the pads of the flex circuit and are coupled with elastomeric springs. In the second embodiment, a flex probe comprises a flex circuit with conductive elastomeric material attached to probe pads on the flex circuit such that the conductive elastomeric layer is between the flex circuit and the electronic assembly to be tested. In the third embodiment, a cantilever is formed in a flexible circuit. The flexible circuit device is attached to a non-conductive stiffener layer such that a portion of the cantilever is extending over a probe pin receiving channel in the non-conductive stiffener layer. A probe pin is inserted into the channel and attached to the portion of the cantilever that is extending over the channel. The probe pins are attached to the corresponding test points on the electronic assembly to be tested. Alternatively, as opposed to using a portion of the flexible circuit as a cantilever, a specialized surface mount technology may be used.
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