发明名称 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, GAS SENSOR AND MANUFACTURING METHOD FOR GAS SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a gas sensor having little possibility of breaking a lead wire, allowing the use of a lead wire having small line diameter and low rigidity, and capable of reducing the power consumption. SOLUTION: The lead wire 6 is joined to a heater electrode 3 and a sensitive body electrode 8 by an ultrasonic thermo compression bonding, whereby as compared with the case of joining the lead wire to the electrode by another general welding method, the wire 6 is hard to break, so that the lead wire 6 having a small wire diameter and low rigidity can be used. The use of the lead wire 6 having a small wire diameter can reduce radiation due to heat transmitted to the lead wire 6, so that the power consumption of a heater for heating the sensitive body membrane 9 to a designated temperature can be reduced.
申请公布号 JP2002340832(A) 申请公布日期 2002.11.27
申请号 JP20010152076 申请日期 2001.05.22
申请人 MATSUSHITA REFRIG CO LTD;MATSUSHITA ELECTRIC IND CO LTD 发明人 SASABE SHIGERU;INOUE YOSHIKATSU;HATTORI AKIYOSHI;YOSHIIKE NOBUYUKI
分类号 G01N27/12;H01L21/60 主分类号 G01N27/12
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