RESIN COMPOSITION FOR DIRECT PLATING, RESIN PLATING METHOD, AND PLATED RESIN ARTICLE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for direct plating which is excellent in properties in direct plating, especially extensibility of electroplated copper, and in impact resistance; a resin plating method using the same; and a plated resin article prepared by using the same. SOLUTION: This resin composition for direct plating contains (C) a graft copolymer formed by the graft polymerization of (b) a monomer component containing an aromatic vinyl compound and a vinyl cyanide compound onto (a) a rubbery polymer having an average particle size of 0.2-0.5μm and containing 5-20 mass% particles having particle sizes of 0.8-1.5μm. The resin plating method comprises subjecting a molded article obtained by molding the resin composition to a Pd-Sn colloid catalyst treatment, then to a conductivity-imparting treatment, and to direct electroplating without subjecting to an accelerator treatment and nonelectrolytic plating after the Pd-Sn colloid catalyst treatment. The plated resin article is obtained by the resin plating method.