SMALL-SCALE OPTOELECTRONIC PACKAGE

摘要

Integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output using electrical connections (82, 83), thermal management using a heat sink (105), an optical window using a transparent insulating substrate (17), and precise passive or mechanical alignment using guide pins (72) to external optical receivers or transmitters (not shown). A transparent insulating substrate (17) having electrical circuitry (88) in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectonic device (203) such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate (17). Arrays of fibers (not shown) may be coupled to arrays of optoelectronic devices (203) through a single transparent substrate (17). The optoelectronic devices (203) are mounted on the transparent insulating substrate (17) in a precise positional relationship to guide holes in the substrate.