发明名称 |
Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface |
摘要 |
A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the heating section is controlled by a control section, in response to the temperature measured by the radiation thermometer. Further, a blackbody is provided at a position optically symmetrical to the radiation thermometer with respect to the surface of the thin film. The blackbody is set at a constant temperature. The blackbody cuts stray light (noise light) which enters into the radiation thermometer.
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申请公布号 |
US6483083(B2) |
申请公布日期 |
2002.11.19 |
申请号 |
US20010877147 |
申请日期 |
2001.06.11 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAKURAI HIDEAKI;KUMAGAE AKITOSHI;HIGASHIKAWA IWAO;ITO SHINICHI;ARIKADO TSUNETOSHI;OKUMURA KATSUYA |
分类号 |
G03F7/38;G01J5/00;G01J5/06;G05D23/27;H01L21/027;(IPC1-7):F27D11/00 |
主分类号 |
G03F7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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