发明名称 |
METHOD FOR CORRECTING TEMPERATURE OF RAPID THERMAL PROCESSING APPARATUS |
摘要 |
PURPOSE: A method for correcting temperature of a rapid thermal processing apparatus is provided to obtain a correction parameter according to a variation of temperature and apply the obtained parameter to a corresponding process by using information including measured temperature of a corresponding time, previous measured temperature, and previous correction temperature. CONSTITUTION: A rapid thermal processing apparatus sets up a correction start temperature for performing a temperature correction process. Thermal correction parameters varied according to various thermal processing conditions are obtained. The obtained thermal correction parameters are stored according to the various thermal processing conditions. The correction temperature is calculated on the basis of measured temperature of a corresponding time, a previous measured temperature, and previous correction temperature by using a corresponding thermal correction parameter of the stored thermal correction parameters.
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申请公布号 |
KR20020086307(A) |
申请公布日期 |
2002.11.18 |
申请号 |
KR20020032754 |
申请日期 |
2002.06.12 |
申请人 |
KORNIC SYSTEMS CORP. |
发明人 |
HUH, HYEOK JUN;JU, SANG RAE;YOEN, JE SEONG |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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