| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a manufacturing cost by increasing the number of element boards which can be placed on an insulating substrate. SOLUTION: The manufacturing cost of the element boards can be reduced by arranging an element area in an area irradiated with laser beam in the central part, arranging an element disusing area in an area irradiated with laser edge, effectively using the insulating substrate only by the portion of the element disusing area, and increasing the number of the element boards which can be placed on a single nonconductive substrate. Moreover, the width of the connection terminal area can be reduced to 1/2 of the least cut-off limit and miniaturizing of a display device can be achieved by arranging connection terminal areas to be opposed to each other, and cutting off in one body the area of the counter substrate opposed to the connection terminal areas keeping them connected with each other.</p> |
