| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for a semiconductor device at low cost having a high fixing strength to a base of separate fins. SOLUTION: A plurality of grooves 1a having a U shaped cross section are provided side by side on the surface of the plate-shaped base 1. By putting the plate-shaped fin 2 having a thickness approximately equal to the groove width of the base between dies arranged top and bottom and pressing, a groove 2b that is most constricted in the top and whose width is equal to that of the groove 1a of the base 1 in the bottom and that changes directly between the top and the bottom, is formed from the bottom edge of the front and back of the fin 2 to the bottom edge side of a position corresponding to the depth of the groove of the base. The bottom edges of the fins 2 are inserted in each groove 1a of the base part 1, and while suppressing the top edges of the fins 2, a base portion 1 of both sides of the fin 2 is pressed by a pressing arrow 6 that is paired together at intervals slightly larger than the thickness of the fin 2 and disposed at intervals of the groove pitch of the base part 1.
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