| 摘要 |
A method (see e.g., FIG. 4) of fabricating a semiconductor device includes forming a trench 12 in a semiconductor body 10. A dielectric layer 26 is formed within the trench 12. Dielectric layer 26 lines the sidewall and, possibly, the bottom portions of the trench 12 in a manner where the thickness of the dielectric 26s at the sidewall is greater than the thickness of the dielectric 26b at the bottom. A dopant 28 can then be implanted into the semiconductor body beneath the trench.
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