INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREFOR AND IC CARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable integrated circuit device of high quality and an IC card using it. SOLUTION: The integrated circuit device 21 is constituted by providing a resin frame body 24 on a wiring board 28 provided with a conductor 22 to be a terminal for external connection and covering an integrated circuit element 25 and a connection means 26 formed on the inner side of the resin frame body 24 with a sealing resin 27.