| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost tape carrier package semiconductor device and a production method therefor, with which an operation defect caused by contacting of the terminal part of a semiconductor device, and a wiring pattern is prevented. SOLUTION: In the tape carrier package semiconductor device, which is provided with a tape carrier 7 constituted by forming a metal wiring pattern 5 on an insulation film 4 and a semiconductor device 1 located to face the tape carrier 7, while having an alminium pad 2 at a position inner than an outer periphery 8 of the confronted face, bonding a bonding part 10 of the metal wiring pattern 5 via a gold bump 3 to the alminium pad 2, with respect to an extension part 11 of the metal wiring pattern 5 extended from directly close by the bonding part 10 to the outside of a region overlapped with the confronted face of the semiconductor device 1; and thin part 11a, having thickness T2 thinner than thickness T1 of the bonding part 10, is formed on the peripheral part of a position overlapped with the outer periphery 8 of the semiconductor device 1.
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