BAKE PROCESSING EQUIPMENT AND BAKE METHOD USING THE SAME

摘要

PURPOSE: A bake processing equipment and a bake method using the same are provided to effectively reduce the temperature of a bake chamber and to shorten stand-by time by using a spray unit for spraying a low temperature gas. CONSTITUTION: A plurality of semiconductor substrate having different bake temperature are prepared(100). The first semiconductor substrate is transferred to a bake chamber(101), and baked in a first processing temperature(102). The first semiconductor substrate is transferred to outside of the bake chamber(103). The temperature of the bake chamber decreases to a second processing temperature by spraying low temperature gas into the bake chamber(104). The second semiconductor substrate is loaded in the bake chamber(105), and baked(106).