Production of an optoelectronic semiconductor component comprises preparing sintered glass blanks, applying an adhesive to the surfaces of the blank to be connected, fixing both blanks in a tool, and forming a mechanical composite

摘要

Production of an optoelectronic semiconductor component comprises preparing two sintered glass blanks (glass bodies); applying an adhesive to the surfaces of the blank to be connected; fixing both blanks in a tool; and forming a mechanical composite of both glass bodies with electrical connections (3, 4) of the chip (2) of the component. Independent claims are also included for alternative methods for producing an optoelectronic semiconductor component. Preferred Features: A pneumatic dispenser is used to precisely dose the adhesive. The mechanical composite is produced by lightly pressing. The process further comprises hardening the adhesive at a temperature above 100 deg C.