发明名称 FLEXIBLE PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which hardly has a dielectric breakdown even if it operates on a high voltage under the conditions of high temperatures and high humidity. SOLUTION: A one-sided or double-sided flexible printed wiring board comprises a base material 1 having a pair of opposed surfaces, wiring pattern layers 2a and 2b formed on either or both of the surfaces of the base material 1, and coverlays 4a and 4b formed above the wiring pattern layers respectively. Oxide films 5a and 5b of silicon oxide or aluminum oxide are formed on at least one of the surfaces of the flexible printed wiring board.
申请公布号 JP2002299802(A) 申请公布日期 2002.10.11
申请号 JP20010104651 申请日期 2001.04.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAZAKI MANABU
分类号 H05K3/28;H05K1/03;(IPC1-7):H05K3/28 主分类号 H05K3/28
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