| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of lowering costs and being miniaturized without damaging versatility. SOLUTION: The semiconductor device for which a semiconductor integrated circuit is constituted on the same substrate is provided with a signal output terminal 2 outputting signals to the outside of the semiconductor integrated circuit, a first external connection electrode 3 directly connected to the signal output terminal, and a second external connection electrode 5 connected to the signal output terminal through a resistor 4.</p> |
