CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit board which can be reduced in size. SOLUTION: The circuit board includes an insulation sheet 29 and a lead frame 30 stacked on the sheet 29; the lead frame 30 has a plurality of electrically conductive patterns 28a and 28b; and the underlying sheet 29 are extended, up to the upper surfaces of the conductive patterns 28a and 28b between the patterns 28a and 28b, and covers both sides of the upper surfaces of the conductive patterns 28a and 28b positioned on both sides thereof.