| 摘要 |
PROBLEM TO BE SOLVED: To provide a router processed method in which on flashes are not generated in processed traces, and to provide a substrate formed thereby. SOLUTION: A processing position is covered with colder resists 1, 1. When the substrates are overlapped, to be subjected to a router process and chips of a resin generated from a core insulated layer 2 of an underside substrate, reach between the substrates, the chip are immediately brought into contact with the section of the solder resist 1, so that the chips are cut by the impact of rotation and are pulverized. The pulverized chips are discharged upwardly, as it is. For this reason, the chips stay in a space between the substrates, and flashes do not occur. Even if the substrate is subjected to the router process in a state of a paper being interposed between the substrates, the same effect can be obtained.
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