| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device where the growth of microcracks is prevented. SOLUTION: The semiconductor device comprises a semiconductor substrate 1, having a surface provided with a circuit element and pads and a backside provided with a groove 4 at its periphery, and a mounting substrate 2 where the surface of this semiconductor substrate 1 is adhered to its surface and connection terminals 8 electrically connected to the pads are provided on its backside.</p> |
