| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a mounting wiring board capable of keeping a connection between a BGA type package and a wiring board even if being subjected to such a severe impact force that not only a reinforcing solder ball but also its adjacent solder ball are broken away. SOLUTION: A mother board 2, which is the wiring board where the BGA type package 1 is mounted, is provided with a land 21 located at a position corresponding to a solder ball 13 on its surface. Lands located in four corners of the mother board 2 are reinforcing lands 22 each having such a size that two other lands 21 are connected. A land 23 adjacent to the reinforcing land 22 and the other reinforcing land 22 located at a position diagonally apart from the reinforcing land 22 are connected by a wire 24 each other. Moreover, associated with this arrangement, a solder ball adjacent to a reinforcing solder ball of the BGA type package 1 and the other reinforcing solder ball located at a position diagonally apart from the reinforcing solder ball are connected by a wire deposited on the board each other. |
