| 发明名称 |
ABRASIVE COMPOSITION FOR THE INTEGRATED CIRCUITS ELECTRONICS INDUSTRY |
| 摘要 |
Abrasive composition for the integrated circuits electronics industry comprising an aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds and an abrasive surfactant, this abrasive being for mechanical chemical polishing in the integrated circuits industry, comprising a fabric impregnated by such a composition, and a process for mechanical chemical polishing.
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| 申请公布号 |
US2002142600(A1) |
申请公布日期 |
2002.10.03 |
| 申请号 |
US19990427675 |
申请日期 |
1999.10.27 |
| 申请人 |
JACQUINOT ERIC;LETOURNEAU PASCAL;RIVOIRE MAURICE |
发明人 |
JACQUINOT ERIC;LETOURNEAU PASCAL;RIVOIRE MAURICE |
| 分类号 |
B24B37/00;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B24B37/00 |
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