| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that it is difficult to conduct monitoring inspection by mounting probes upright and much cost is required because high density of mounted semiconductor devices and multiple pins on a device. SOLUTION: This scan test method uses a semiconductor device that is provided with a scan register to be connected between the I/O pin on the analog input side and an internal system logic, another semiconductor device that is provided with a scan register to be connected between the I/O pint of the analog output side and an analog sensor, and an analog wiring connecting the I/O pins to each other. The scan registers are chained together, which comprise a boundary scan register chain as to control a JTAG by a TAPC. |
