An apparatus includes a package having a first surface and a conductive contact exposed at the first surface. A capacitor is inside the package. The capacitor has a first conductive contact exposed at a first surface of the capacitor. The first conductive contact has a first portion spanning a width of the first surface of the capacitor. The first surface of the capacitor is substantially parallel to the first surface of the package. A conductive path connects the first portion of the first conductive contact of the capacitor to the first conductive contact proximate the first surface of the package.
申请公布号
WO02078054(A2)
申请公布日期
2002.10.03
申请号
WO2002US04144
申请日期
2002.02.11
申请人
INTEL CORPORATION;FIGUEROA, DAVID, G.;MALLIK, DEBENDRA;RODRIGUEZ, JORGE, P.
发明人
FIGUEROA, DAVID, G.;MALLIK, DEBENDRA;RODRIGUEZ, JORGE, P.