| 发明名称 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, semiconductor wafer and method for manufacturing semiconductor device by using sealing apparatus |
| 摘要 |
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
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| 申请公布号 |
US2002140114(A1) |
申请公布日期 |
2002.10.03 |
| 申请号 |
US20020103889 |
申请日期 |
2002.03.25 |
| 申请人 |
MATSUMOTO JIRO |
发明人 |
MATSUMOTO JIRO |
| 分类号 |
B29C45/26;B29C45/02;B29C45/14;B29C45/37;H01L21/00;H01L21/56;H01L23/12;(IPC1-7):B29C70/72;H01L23/28 |
主分类号 |
B29C45/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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